shinichi maki
Fun Poster
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- Feb 2, 2009
- Messages
- 985
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Salam Semua, den ada sedikit kekosongan untuk CGrian kalau anda berminat. Tempat kerja area seremban, so kalau apa2 leh PM saya.
JOB TITLE : NPI ENGINEER
Practical Responsibilities
1.Assembly lead for new product introduction projects.
2.Communication point between BL and assembly to ensure smooth release from development to full production.
3.Involve in technical evaluation, process development and test job creation within project.
4.Coordinate, evaluate and analyze new product in terms design, process workability/definition and manufacturability.
5.Responsible to ensure all documents for new product release are reviewed, updated and properly documented.
6.Encourage, motivate, and develop self and others to optimized knowledge and capability.
7.Regular communication with subordinate (if any) to ensure consistent performance.
Criteria for selection:
1.Degree in Electronics/Electrical Engineering, Computing related or equivalent.
2.Minimum 2 years industrial experience in related field.
3.Dynamic, initiative, resourceful with good interpersonal and communication skill with people at all levels.
JOB TITLE : PACKAGE DEVELOPMENT ENGINEER
General Job Description
Package Engineer is responsible to co-ordinate, design, evaluate and analyze all technical aspects to release new semiconductor packages. Work as a team to release new packages and to ensure quality and smooth transfer from design to production.
In order to meet the requirement, the incumbent needs to liase with other departments internally as well as externally.
Practical Responsibilities
1.Assembly lead for new package projects.
2.Communication point between BL and assembly to ensure smooth release from development to full production.
3.Involve in package design, leadframe design, BoM selection, equipment capability evaluation and process development for new packages.
4.Coordinate, evaluate and analyze new package in terms cost, design robustness, process workability/definition and manufacturability.
5.Responsible to ensure all documents for new package release are reviewed, updated and properly documented.
6.Encourage, motivate, and develop self and others to optimized knowledge and capability.
7.Regular communication with subordinate (if any) to ensure consistent performance.
Others
1.To support the Environmental Health and Safety of the Company as per ISO 14001 EMS requirement.
2.To support any quality improvement activities.
Criteria for selection:
1.Degree in Mechanical Engineering/Material Sciences related or equivalent.
2. Minimum 2 years industrial experience in related field.
3. Dynamic, initiative, resourceful with good interpersonal and communication skill with people at all levels.
4. The incumbent is also expected to have comprehensive knowledge process and equipment technologies related to semiconductor packaging.
JOB TITLE : PROCESS DEVELOPMENT ENGINEER (PACKAGE SAW/TRIM&FORM)
General Job Description
The focus of his / her responsibilities is process optimization on Assembly segment with minimum supervision involve heavily in New Process Development
His / Her involvement would cover problem solving, project & evaluation. They should able to contribute, coach & advise based on technical knowledge related.
Practical Responsibilities
Essential Functions
1.Process knowledge for Assembly area Package Saw & Trim Form.
2.Develop use of new technology to achieve cost savings in existing parts.
3.Continue to do self-study to enhance self knowledge in the area of expertise.
4.Involve in resolving factory chronic problems permanently.
5.Sharing knowledge with others via training or any other people development program
6.Set-up, evaluate, and buyoff new equipment and process.
7.Release timely with satisfactory performance to production
8.Coordinate, evaluate and analyze transfer devices in terms design, process workability/definition and manufacturability.
9. Responsible to Transfer Product and coordinate on-site
10.Encourage, motivate, and develop self and others to optimized knowledge and capability.
11.Supports new package assessments and follow up experimental during the planning stage for scale-up and technology transfer
12.Responsible for capacity transfer and ramp-up
13Regular communication with subordinate (if any) to ensure consistent performance.
Expectations
1.To be involved in the process optimization on Molding and Package Sawing during new package development
2.Ability to meet deadline on project assigned.
3.Has ability to adapt to the changing needs of a project.
4.Have strong communication skills, both in writing and orally.
Others
1.To support the Environmental Health and Safety of the Company as per ISO 14001 EMS requirement.
2.To support any quality improvement activities.
Criteria for selection:
1.Degree in Material/ Mechanical/ Electrical/ Electronic Engineering, Applied Science or any equivalent engineering discipline
2.Minimum of 2 years working experiences in semiconductor assembly manufacturing environment.
3.Has knowledge on Assembly Process and new product development
4.Has ability to focus in depth to solve problem in his/her area of interest. Skeptical, sometimes critical, always analytical.
5.Has original minds and great drive for implementing his/her ideas and achieving his/her goal.
JOB TITLE : PROCESS DEVELOPMENT ENGINEER (DIE BONDING/WIRE BONDING)
General Job Description
The focus of his / her responsibilities is process optimization on Assembly segment with minimum supervision involve heavily in New Process Development
His / Her involvement would cover problem solving, project & evaluation. They should able to contribute, coach & advise based on technical knowledge related.
Practical Responsibilities
Essential Functions
1.Process knowledge for Assembly area including saw, die bonding & wire bonding
2.Develop use of new technology to achieve cost savings in existing parts.
3.Continue to do self-study to enhance self knowledge in the area of expertise.
4.Involve in resolving factory chronic problems permanently.
5.Sharing knowledge with others via training or any other people development program
6.Set-up, evaluate, and buyoff new equipment and process.
7.Release timely with satisfactory performance to production
8.Coordinate, evaluate and analyze transfer devices in terms design, process workability/definition and manufacturability.
9.Responsible to Transfer Product and coordinate on-site
10.Responsible to ensure all documents for new product release are reviewed, updated and properly documented.
11.Supports new package assessments and follow up experimental during the planning stage for scale-up and technology transfer
12.Encourage, motivate, and develop self and others to optimized knowledge and capability.
13.Responsible for capacity transfer and ramp-up
14.Regular communication with subordinate (if any) to ensure consistent performance.
Expectations
1.To be involved in the process optimization on Au/Cu wire bonding during new package development
2.Ability to meet deadline on project assigned.
3.Has ability to adapt to the changing needs of a project.
4.Have strong communication skills, both in writing and orally.
Others
1.To support the Environmental Health and Safety of the Company as per ISO 14001 EMS requirement.
2.To support any quality improvement activities.
Criteria for selection:
1.Degree in Material/ Mechanical/ Electrical/ Electronic Engineering, Applied Science or any equivalent engineering discipline
2.Minimum of 2 years working experiences in semiconductor assembly manufacturing environment.
3.Has knowledge on Assembly Process and new product development
4.Has ability to focus in depth to solve problem in his/her area of interest. Skeptical, sometimes critical, always analytical.
5.Has original minds and great drive for implementing his/her ideas and achieving his/her goal.
JOB TITLE : PRODUCT AND TEST ENGINEER
General Job Description
The focus of his / her responsibilities is on developing internal expert & involve in solving chronic/ critical related factory issues by providing technical knowledge on element detail based on research & analysis for backend area.
His/ Her involvement in any problem solving, project, evaluation should be through coaching & advising based on technical knowledge related.
Practical Responsibilities
1.Test Handler Specialist in BE area, including electronics and software for Trim & Form machines.
2.Responsible to document the electronics circuitry, software flows, Control system, machine sequence, parts drawing etc. for BE equipment’s.
3.Expert for others to refer to.
4.Involve in resolving factory chronic problems permanently.
5.Involve in new equipment evaluation and introduction.
6.Involve in any automation project in BE.
7.CRB and IFC Committee for test process and test handlers.
8.Continue to do self-study to enhance self knowledge in the area of expertise.
9.Sharing knowledge with others via training or any other people development program.
Criteria for Selection:
1.Degree in Engineering Studies or equivalent.
2.Minimum 3 years experience in Engineering field.
3.Ability to communicate and interact with all levels of employees and people.
4.Knowledge on machine function up to component level, machine sequence, control system, software, parts design, material, fabrication, parts treatment etc.
5.Has knowledge on electronics design, control system, mechanical design etc.
6.Has ability to focus in depth to solve problem in his/her area of interest. Skeptical, sometimes critical, always analytical.
7.Has original minds and great drive for implementing his/her ideas and achieving his/her goal.
8.Willing to travel and stay oversea for months.
9.Willing to sign contract with NXP upon oversea training-Refer to HR policy.
JOB TITLE : EQUIPMENT ENGINEER
Responsibilities:
Equipment Engineer is responsible to identify, to develop and to implement new equipment technology, equipment software and data acquisition systems in Saw, front end, mid end and back end. Responsible to oversee and manage vary equipment utilized in manufacturing. Work as a team to improve equipment and manufacturing system in the factory in terms of DEE, yield, productivity, quality and cost.
In order to meet the requirement, the incumbent needs to work closely with other departments internally as well as externally.
Practical Responsibilities
1.Identify, develop, coordinate, and implement new equipment technology and information systems for improving DEE, yield, productivity, quality and cost in the timely and efficiently manner using project management approach.
2.Responsible to lead and manage equipment software and data acquisition systems in Saw, front end, mid end and back end.
3.Work closely with Process Engineer, QA Engineer, Manufacturing, and other personnel to resolve day to day equipment, quality, and yield issues. Further identify opportunities and execute plans for improvement.
4.To cooperate and support Manufacturing, QA and other Engineering groups to resolve all equipment related issues.
5.To own IFC items, DEE improvement and ramp-up activities.
6.Be the resource person and subject matter expert of the factory in the area of focus.
7.Work as a team to ensure the achievement of factory set goals.
Others
1.Responsible for the TS16949 requirement.
2.Responsible for the Environmental Health and Safety of the Company as per ISO 14001 EMS requirement.
3.To get involve in TPM (Total Productive Maintenance) activities for plant continuous improvement.
Requirements:
1.Degree in Electrical / Electronics / Mechanical Engineering or equivalent.
2.Minimum 2 years industrial experience in related field.
3.Dynamic, initiative, resourceful with good interpersonal and communication skill with people at all levels.
JOB TITLE : SECTION HEAD – COMPENSATION & BENEFIT
Responsibilities:
1.Responsible to drive and manage systems (SAP) and process improvement initiatives for core HR processes and policies in compliance with Labor regulations.
2.Maintain employee database to ensure data integrity, confidentiality and reliability of reports at all times.
3.Perform role of HR payroll administrator using SAP system.
4.Generate HR related reports for management’s review.
5.Conduct compensation and benefits (C&B) induction package for new hires,
6.Administer C&B matters in terms of confirmation, promotion, new hire salary calibration, equity adjustment, and preparation of offer letter and employment certification.
7.Drive implementation and communicate to employees on new or revised compensation and benefits programs.
8.Handle administration of compensation and incentive programs and responsible for performance appraisal exercise and annual salary increment.
9.Carry out salary benchmarking and marker data analysis to ensure internal and external equity.
10.Responsible for personal files for employees, maintenance of employees information in the HRMS system and leave management.
11.Generate HR related reports for management’s review.
Requirements:
1.Degree in Human Resources Management, Business Administration or equivalent.
2.4-5 years recent experience in Human Resources field preferably as a generalist.
3.Strong MS Office skills including Words, Excel, PowerPoint and Visio.
4.Strong knowledge of HR-SAP systems and HR process orientation.
5.A strong team player and tactful in handling confidential matters.
JOB TITLE : NPI ENGINEER
Practical Responsibilities
1.Assembly lead for new product introduction projects.
2.Communication point between BL and assembly to ensure smooth release from development to full production.
3.Involve in technical evaluation, process development and test job creation within project.
4.Coordinate, evaluate and analyze new product in terms design, process workability/definition and manufacturability.
5.Responsible to ensure all documents for new product release are reviewed, updated and properly documented.
6.Encourage, motivate, and develop self and others to optimized knowledge and capability.
7.Regular communication with subordinate (if any) to ensure consistent performance.
Criteria for selection:
1.Degree in Electronics/Electrical Engineering, Computing related or equivalent.
2.Minimum 2 years industrial experience in related field.
3.Dynamic, initiative, resourceful with good interpersonal and communication skill with people at all levels.
JOB TITLE : PACKAGE DEVELOPMENT ENGINEER
General Job Description
Package Engineer is responsible to co-ordinate, design, evaluate and analyze all technical aspects to release new semiconductor packages. Work as a team to release new packages and to ensure quality and smooth transfer from design to production.
In order to meet the requirement, the incumbent needs to liase with other departments internally as well as externally.
Practical Responsibilities
1.Assembly lead for new package projects.
2.Communication point between BL and assembly to ensure smooth release from development to full production.
3.Involve in package design, leadframe design, BoM selection, equipment capability evaluation and process development for new packages.
4.Coordinate, evaluate and analyze new package in terms cost, design robustness, process workability/definition and manufacturability.
5.Responsible to ensure all documents for new package release are reviewed, updated and properly documented.
6.Encourage, motivate, and develop self and others to optimized knowledge and capability.
7.Regular communication with subordinate (if any) to ensure consistent performance.
Others
1.To support the Environmental Health and Safety of the Company as per ISO 14001 EMS requirement.
2.To support any quality improvement activities.
Criteria for selection:
1.Degree in Mechanical Engineering/Material Sciences related or equivalent.
2. Minimum 2 years industrial experience in related field.
3. Dynamic, initiative, resourceful with good interpersonal and communication skill with people at all levels.
4. The incumbent is also expected to have comprehensive knowledge process and equipment technologies related to semiconductor packaging.
JOB TITLE : PROCESS DEVELOPMENT ENGINEER (PACKAGE SAW/TRIM&FORM)
General Job Description
The focus of his / her responsibilities is process optimization on Assembly segment with minimum supervision involve heavily in New Process Development
His / Her involvement would cover problem solving, project & evaluation. They should able to contribute, coach & advise based on technical knowledge related.
Practical Responsibilities
Essential Functions
1.Process knowledge for Assembly area Package Saw & Trim Form.
2.Develop use of new technology to achieve cost savings in existing parts.
3.Continue to do self-study to enhance self knowledge in the area of expertise.
4.Involve in resolving factory chronic problems permanently.
5.Sharing knowledge with others via training or any other people development program
6.Set-up, evaluate, and buyoff new equipment and process.
7.Release timely with satisfactory performance to production
8.Coordinate, evaluate and analyze transfer devices in terms design, process workability/definition and manufacturability.
9. Responsible to Transfer Product and coordinate on-site
10.Encourage, motivate, and develop self and others to optimized knowledge and capability.
11.Supports new package assessments and follow up experimental during the planning stage for scale-up and technology transfer
12.Responsible for capacity transfer and ramp-up
13Regular communication with subordinate (if any) to ensure consistent performance.
Expectations
1.To be involved in the process optimization on Molding and Package Sawing during new package development
2.Ability to meet deadline on project assigned.
3.Has ability to adapt to the changing needs of a project.
4.Have strong communication skills, both in writing and orally.
Others
1.To support the Environmental Health and Safety of the Company as per ISO 14001 EMS requirement.
2.To support any quality improvement activities.
Criteria for selection:
1.Degree in Material/ Mechanical/ Electrical/ Electronic Engineering, Applied Science or any equivalent engineering discipline
2.Minimum of 2 years working experiences in semiconductor assembly manufacturing environment.
3.Has knowledge on Assembly Process and new product development
4.Has ability to focus in depth to solve problem in his/her area of interest. Skeptical, sometimes critical, always analytical.
5.Has original minds and great drive for implementing his/her ideas and achieving his/her goal.
JOB TITLE : PROCESS DEVELOPMENT ENGINEER (DIE BONDING/WIRE BONDING)
General Job Description
The focus of his / her responsibilities is process optimization on Assembly segment with minimum supervision involve heavily in New Process Development
His / Her involvement would cover problem solving, project & evaluation. They should able to contribute, coach & advise based on technical knowledge related.
Practical Responsibilities
Essential Functions
1.Process knowledge for Assembly area including saw, die bonding & wire bonding
2.Develop use of new technology to achieve cost savings in existing parts.
3.Continue to do self-study to enhance self knowledge in the area of expertise.
4.Involve in resolving factory chronic problems permanently.
5.Sharing knowledge with others via training or any other people development program
6.Set-up, evaluate, and buyoff new equipment and process.
7.Release timely with satisfactory performance to production
8.Coordinate, evaluate and analyze transfer devices in terms design, process workability/definition and manufacturability.
9.Responsible to Transfer Product and coordinate on-site
10.Responsible to ensure all documents for new product release are reviewed, updated and properly documented.
11.Supports new package assessments and follow up experimental during the planning stage for scale-up and technology transfer
12.Encourage, motivate, and develop self and others to optimized knowledge and capability.
13.Responsible for capacity transfer and ramp-up
14.Regular communication with subordinate (if any) to ensure consistent performance.
Expectations
1.To be involved in the process optimization on Au/Cu wire bonding during new package development
2.Ability to meet deadline on project assigned.
3.Has ability to adapt to the changing needs of a project.
4.Have strong communication skills, both in writing and orally.
Others
1.To support the Environmental Health and Safety of the Company as per ISO 14001 EMS requirement.
2.To support any quality improvement activities.
Criteria for selection:
1.Degree in Material/ Mechanical/ Electrical/ Electronic Engineering, Applied Science or any equivalent engineering discipline
2.Minimum of 2 years working experiences in semiconductor assembly manufacturing environment.
3.Has knowledge on Assembly Process and new product development
4.Has ability to focus in depth to solve problem in his/her area of interest. Skeptical, sometimes critical, always analytical.
5.Has original minds and great drive for implementing his/her ideas and achieving his/her goal.
JOB TITLE : PRODUCT AND TEST ENGINEER
General Job Description
The focus of his / her responsibilities is on developing internal expert & involve in solving chronic/ critical related factory issues by providing technical knowledge on element detail based on research & analysis for backend area.
His/ Her involvement in any problem solving, project, evaluation should be through coaching & advising based on technical knowledge related.
Practical Responsibilities
1.Test Handler Specialist in BE area, including electronics and software for Trim & Form machines.
2.Responsible to document the electronics circuitry, software flows, Control system, machine sequence, parts drawing etc. for BE equipment’s.
3.Expert for others to refer to.
4.Involve in resolving factory chronic problems permanently.
5.Involve in new equipment evaluation and introduction.
6.Involve in any automation project in BE.
7.CRB and IFC Committee for test process and test handlers.
8.Continue to do self-study to enhance self knowledge in the area of expertise.
9.Sharing knowledge with others via training or any other people development program.
Criteria for Selection:
1.Degree in Engineering Studies or equivalent.
2.Minimum 3 years experience in Engineering field.
3.Ability to communicate and interact with all levels of employees and people.
4.Knowledge on machine function up to component level, machine sequence, control system, software, parts design, material, fabrication, parts treatment etc.
5.Has knowledge on electronics design, control system, mechanical design etc.
6.Has ability to focus in depth to solve problem in his/her area of interest. Skeptical, sometimes critical, always analytical.
7.Has original minds and great drive for implementing his/her ideas and achieving his/her goal.
8.Willing to travel and stay oversea for months.
9.Willing to sign contract with NXP upon oversea training-Refer to HR policy.
JOB TITLE : EQUIPMENT ENGINEER
Responsibilities:
Equipment Engineer is responsible to identify, to develop and to implement new equipment technology, equipment software and data acquisition systems in Saw, front end, mid end and back end. Responsible to oversee and manage vary equipment utilized in manufacturing. Work as a team to improve equipment and manufacturing system in the factory in terms of DEE, yield, productivity, quality and cost.
In order to meet the requirement, the incumbent needs to work closely with other departments internally as well as externally.
Practical Responsibilities
1.Identify, develop, coordinate, and implement new equipment technology and information systems for improving DEE, yield, productivity, quality and cost in the timely and efficiently manner using project management approach.
2.Responsible to lead and manage equipment software and data acquisition systems in Saw, front end, mid end and back end.
3.Work closely with Process Engineer, QA Engineer, Manufacturing, and other personnel to resolve day to day equipment, quality, and yield issues. Further identify opportunities and execute plans for improvement.
4.To cooperate and support Manufacturing, QA and other Engineering groups to resolve all equipment related issues.
5.To own IFC items, DEE improvement and ramp-up activities.
6.Be the resource person and subject matter expert of the factory in the area of focus.
7.Work as a team to ensure the achievement of factory set goals.
Others
1.Responsible for the TS16949 requirement.
2.Responsible for the Environmental Health and Safety of the Company as per ISO 14001 EMS requirement.
3.To get involve in TPM (Total Productive Maintenance) activities for plant continuous improvement.
Requirements:
1.Degree in Electrical / Electronics / Mechanical Engineering or equivalent.
2.Minimum 2 years industrial experience in related field.
3.Dynamic, initiative, resourceful with good interpersonal and communication skill with people at all levels.
JOB TITLE : SECTION HEAD – COMPENSATION & BENEFIT
Responsibilities:
1.Responsible to drive and manage systems (SAP) and process improvement initiatives for core HR processes and policies in compliance with Labor regulations.
2.Maintain employee database to ensure data integrity, confidentiality and reliability of reports at all times.
3.Perform role of HR payroll administrator using SAP system.
4.Generate HR related reports for management’s review.
5.Conduct compensation and benefits (C&B) induction package for new hires,
6.Administer C&B matters in terms of confirmation, promotion, new hire salary calibration, equity adjustment, and preparation of offer letter and employment certification.
7.Drive implementation and communicate to employees on new or revised compensation and benefits programs.
8.Handle administration of compensation and incentive programs and responsible for performance appraisal exercise and annual salary increment.
9.Carry out salary benchmarking and marker data analysis to ensure internal and external equity.
10.Responsible for personal files for employees, maintenance of employees information in the HRMS system and leave management.
11.Generate HR related reports for management’s review.
Requirements:
1.Degree in Human Resources Management, Business Administration or equivalent.
2.4-5 years recent experience in Human Resources field preferably as a generalist.
3.Strong MS Office skills including Words, Excel, PowerPoint and Visio.
4.Strong knowledge of HR-SAP systems and HR process orientation.
5.A strong team player and tactful in handling confidential matters.
